MXene材料 Ti3C2 Nb2C MOF材料 Ti3C2 Nb2C 北科纳米

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Detailed

Product Name: Micron copper powder (spherical copper powder, flake copper powder, dendritic copper powder)
color: red
Specifications: 50nm, 80nm, 100nm, 200nm, 300nm, 500nm, 800nm, spherical 1um, 1um, 5um, 10um, 20um, flake 1um, flake 15um, flake 30um, flake 45um, 150nm-20um flake, 10um Dendritic, 20um dendritic, 45um dendritic, 75um dendritic, 1000 mesh, 30um spherical copper powder, 50um spherical copper powder
Application
1. The surface of copper powder has low oxygen content and is suitable for sintering copper paste. It is used in the production of microelectronic devices to manufacture terminals and internal and external electrodes, electronic components and electronic conductive pastes of multilayer ceramic capacitors, so that microelectronic devices can be miniaturized. It can replace the precious metal powder to prepare the electronic slurry with superior performance, which can greatly reduce the cost and optimize the microelectronic process;
2. Nano-metal lubricating additive and nano-metal self-repairing agent: adding 0.1~0.6% to lubricating oil and grease, forming self-lubricating and self-repairing film on the surface of the friction surface during the friction process, and significantly improving the resistance during friction Grinding and reducing friction performance, improving equipment service life and maintenance cycle;
3, metal and non-metal surface conductive coating treatment: nano-aluminum, copper, nickel powder has a high activation surface, under anaerobic conditions can be applied at a temperature below the melting point of the powder, this technology can be applied to micro Production of electronic devices;
4. High-efficiency catalyst: copper and its alloy nano-powder are used as catalysts, with high efficiency and strong selectivity, and can be used as catalysts in the reaction process of carbon dioxide and hydrogen synthesis of methanol;
5. Raw materials for bulk metal nanomaterials: preparing bulk copper metal nanocomposite structural materials by inert gas protection powder metallurgy sintering;
6. The high purity, good electrical conductivity and low electrical resistance of the flake copper powder can partially replace the silver powder to prepare low temperature polymer conductor, conductive adhesive, etc. It can also be made into conductive, electromagnetic shielding and anti-static products, mainly used for electrical and lubricating materials. Communication engineering, machinery manufacturing, building materials, electronic components, household appliances and other fields have significantly reduced production costs. In addition, flake copper powder is the main raw material for the production of widely used silver-coated copper powder, and has broad application prospects;
7. Copper powder is widely used in conductive coatings, conductive adhesives and conductive pastes. Copper powder is used as a thermal conductive filler in epoxy glue. The thermal conductivity is good. The copper powder as a conductive filler has the conductivity and conductivity of the conductive material. The properties of the prepared conductive paste have a great influence. The spherical conductive filler is mainly point contact, and the flaky filler is mainly in surface contact, which is favorable for charge conduction, and the surface is smooth, which can increase the contact area, which is favorable for conductivity. Improvement.