Vacuum coating refers to the deposition of a metal or non-metal on the surface of the material in the form of a vapor in a vacuum environment to form a dense film. The quality of the coating is critical to the functional formation of semiconductor devices.
Coating technology is mainly used in the manufacturing process of micro-nano semiconductor devices. Metal and ITO materials are mainly used in the preparation of electrodes, and other non-metallic materials are mainly used in the preparation of insulating dielectric layers and sacrificial mask layers.
Master coating technology:
Electron beam evaporation Magnetron sputtering LPCVD PECVD ALD
Coating material:
Metal: Ti, Al, Ni, Au, Ag, Cr, Pt, Cu, TiW90, Pd, Zn, Mo, W, Ta, Nb, etc. Non-metal: Si, SiO2, SiNx, Al2O3, HFO2, MgF2, ITO, Ta2O5, etc.
Coated substrate:
Silicon wafer, quartz glass wafer, sapphire wafer, PET, Pi, etc.
Master a variety of coating technologies and a wide range of coating materials Coating thickness range: 5nm-2000nm Base size 6 inches downward compatible The uniformity of the coating is good, and the coating is dense.
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