2-inch Free-standing U-GaN Substrates |
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Excellent level (S) |
Production level (A) |
Research level (B) |
Dummy level (C) |
Note: |
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S-1 |
S-2 |
A-1 |
A-2 |
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Dimension |
50.8 ± 1 mm |
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Thickness |
350 ± 25 μm |
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Orientation flat |
(1-100) ± 0.5°, 16 ± 1 mm |
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Secondary orientation flat |
(11-20) ± 3°, 8 ± 1 mm |
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Resistivity (300K) |
< 0.05 Ω·cm for N-type (Si-doped; GaN-FS-C-N-C50) |
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TTV |
≤ 15 μm |
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BOW |
≤ 20 μm |
≤ 40 μm |
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Ga face surface roughness |
< 0.2 nm (polished) |
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N face surface roughness |
0.5 ~1.5 μm |
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Package |
Packaged in a cleanroom in single wafer container |
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Useable area |
> 90% |
>80% |
>70% |
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<9.9x105 cm-2 |
<3x106 cm-2 |
<9.9x105 cm-2 |
<3x106 cm-2 |
<3x106cm-2 |
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Orientation:C plane (0001) off angle toward M-axis |
0.35 ± 0.15°(5 points) |
0.35 ± 0.15°(5 points) |
0.35 ± 0.15°(3 points) |
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Macro defect density (hole) |
0 cm2 |
< 0.3 cm -2 |
< 1 cm -2 |
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Max size of macro defects |
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< 700 μm |
< 2000 μm |
< 4000 μm |
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