Polyimide (PI) is made from pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a highly polar solvent by polycondensation and casting into a film and then imidization. Polyimide has excellent high and low temperature resistance, electrical insulation, adhesion, medium resistance, mechanical properties and radiation resistance. It can be used for a long time within the temperature range of -269 ℃ -280 ℃, and can be achieved in a short time. 400 ℃ high temperature. Beike Nano masters two types of device processing technology, PI dry film and PI glue, to provide customers with quality technical services.
As a special engineering material, polyimide is widely used in aviation, aerospace, microelectronics, nano, liquid crystal, separation membrane, laser and other fields.
Dry film: thickness 20-150um, etching depth ≤15um Photosensitive solution: minimum line width 5um, thickness 5-20um Non-photosensitive solution: etching depth 0-15um
At the same time master dry film & PI glue processing technology Dry film etching depth up to 15um Master the multi-layer PI film stacking process Good adhesion
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